1.0 Introduction
2.0 Benefits of LTPS Technology
3.0 LTPS Target Applications
4.0 Challenges for LTPS
5.0 Overview of LTPS TFT Technology and Manufacturing
5.1 Electrical Characteristics
5.1.1 ON Current and Mobility
5.1.2 Leakage Current
5.1.3 Threshold Voltage
5.1.4 Bandwidth and Design Rules
5.1.5 Electrical Characteristics Interrelationships
5.2 Roadmap
5.3 Status of LTPS TFT Production
5.3.1 Device Structures
5.3.2 Manufacturing Processes
5.3.3 Process Temperatures & Glass Substrates
5.4 Yields
5.4.1 Defect Modes
5.4.2 Defect Pareto Charts
5.4.3 Yield Curves
6.0 LTPS Unique Process Equipment Requirements
6.1 Activation
6.1.1 Basic Technology
6.1.2 Equipment Makers and Specifications
6.1.3 Gas Heat Type RTP
6.1.4 Selective Heating Type
6.2 AOI
6.2.1 Basic Technology
6.2.2 LTPS Unique AOI Applications, Use Models and Advanced Specifications
6.2.3 Equipment Makers and Specifications
6.3 Cleaning
6.3.1 Basic Technology
6.3.2 LTPS Unique Cleaning Requirements and Use Models
6.3.3 Equipment Makers and Specifications
6.4 Coater Developers
6.5 Crystallization
6.5.1 Basic Technology and Technology Trends
6.5.2 Excimer Laser Annealing (ELA)
6.5.3 Enhanced ELA
6.5.4 Solid Phase Crystallization and Continuous Grain Silicon
6.5.5 Solid State Laser Annealing
6.5.6 Direct Deposit of p-Si
6.5.7 Trends
6.5.8 Equipment Makers and Specifications
6.6 CVD & Dehydrogenation
6.6.1 Basic Technology
6.6.2 LTPS Unique CVD Applications, Use Models and Advanced Specifications
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6.6.3 Equipment Makers and Specifications
6.7 Etch
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6.7.1 Basic Technology
6.7.2 LTPS Unique Etching Applications, Use Models and Advanced
Specifications
6.7.3 Equipment Makers and Specifications
6.8 Hydrogenation
6.8.1 Unique Hydrogenation Applications, Use Models and Advanced
Specifications
6.9 Ion Doping
6.9.1 Basic Technology
6.9.2 Ion Implant Applications, Use Models and Advanced Specifications
6.9.3 Market Participants and Specifications
6.10 Lithography
6.10.1 Basic Technology
6.10.2 LTPS Lithography Applications, Use Models and Advanced Specifications
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6.10.3 Market Participants and Specifications
6.11 PVD
6.11.1 Basic Technology
6.11.2 PVD Applications, Use Models and Advanced Specifications Relevant for
LTPS 176
6.11.3 Market Participants and Specifications
6.12 Repair
6.13 Strip
6.13.1 Basic Technology
6.13.2 LTPS Unique Stripping Applications, Use Models and Advanced
Specifications
6.13.3 Equipment Makers and Specifications
6.14 Test
6.14.1 Basic Technology
6.14.2 LTPS Unique Array Test Applications, Use Models and Advanced
Specifications
6.14.3 Equipment Makers and Specifications
7.0 Driver Electronics
7.1 Electro-optic Behavior of Liquid Crystals
7.2 Active Matrix LCD Pixel Circuit and Addressing
7.3 AMLCD Electronics
7.3.1 Row Drivers
7.3.2 Data Drivers
7.3.3 Timing Controllers and Interfaces
7.4 Amorphous Silicon Gate Driver Integration
7.5 Integrated Drivers with Low-Temperature Poly-Silicon
7.5.1 Integrating the Gate Drivers with LTPS
7.5.2 Integrating the DC-DC Converter
7.5.3 Integrating DACs
7.5.4 Driver Circuitry Integrated in PMOS
7.5.5 Power Consumption in Second Generation System-on-Glass
7.5.6 Full System Integration
8.0 Cost Modeling
8.1 Substrate Size
8.2 Manufacturing Costs by Production Process
8.2.1 TFT Array Process and Equipment (Front-End)
8.3 Yields
8.3.1 LTPS Array Yields
8.3.2 Process Parameters
8.4 LTPS Cost: Segmenting Costs by Type
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8.4.1 Cell Phone Display Cost
8.4.2 4" PDA Display Costs
8.4.3 12.1" Notebook Sized Display Costs Segmented
9.0 LTPS Manufacturers
9.1 Profiles
9.1.1 AU Optronics (AUO)
9.1.2 BOE Hydis
9.1.3 Chi Mei Optoelectronics (CMO)
9.1.4 ELDis
9.1.5 Hitachi Displays
9.1.6 ITRI/ERSO
9.1.7 LG.Philips LCD (LPL)
9.1.8 Mitsubishi
9.1.9 NEC
9.1.10 Samsung
9.1.11 Samsung SDI
9.1.12 Sanyo Epson
9.1.13 Sharp
9.1.14 ST-LCD including STMD
9.1.15 Toppoly
9.1.16 Toshiba Matsushita Display (TMD), Including AFPD
9.2 LTPS Capacity Summary
10.0 Forecast
10.1 Investment Forecast
10.2 Demand, Price and Revenue Forecasts
10.3 Supply/Demand Forecast & Conclusion
11.0 Glossary